HYPERVPR™ (pronounced Hyper Vapour) is a pulsating heat pipe plate engineered to enhance conduction cooling in embedded computing applications where mass considerations and plug-in module profile are critical and processing power is in the range of 50 to 450 Watts in 3U, 4U, 6U and custom form factors.

The HYPERVPR™ plates are supplied as standard products for 3U and 6U VPX form factors and custom designs are rapidly available for 4 U and other unique form factors such as ADHA, cPCI Serial or others.

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The plates are mounted directly on top of standard heat-frames and they extend all the way into the chassis slot for optimized and direct thermal transfer. The thermal connection between the heat-frame and the HYPERVPR™ plate is achieved using PHENOMENA™ TIM with 100µm diamond particles embedded into a 100µm recessed grid pattern to achieve the lowest possible thermal resistance at the metal-to-metal connection.

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