PERFORMANCE INTERCONNECT
PHENOMENA™ TIM AND Cu-Di COMPOSITE
Advanced Diamond Composite Thermal Materials
PHENOMENA™ is the ultimate expression of performance in thermally conductive composite materials based on mono-crystalline diamonds with Tc>2000W/mK.
The PHENOMENA™ I - PATENT-PENDING Thermal Interface Material is used to connect processors to heat spreaders, heat plates or to achieve large area metal-to-metal interfaces with low thermal resistance. The matrix special formulation has an ultra-high concentration of highly diffusive nano particles binding high-quality diamonds in a monolayer configuration between two surfaces to achieve an efficient thermal transfer mechanism. The high-performance compound is compatible with high vacuum environment for space-flight applications.
The PHENOMENA™ II - Copper-Diamond (CuDi) Composite Alloy is a superlative advancement in material technology achieved through a complex sintering process combining high-quality mono-crystalline diamonds with a natural Tc > 2000W/mK and pure copper powder with a TC = 394 W/mK. The sintered composite material displays nearly "magic" thermal conductivity performance with a TC from 760 to 780 W/mK and is an extraordinary solution in conduction cooling applications regardless of their environment. It works with equal effectiveness under extreme G forces and under the harsh conditions of deep space in total absence of gravity.
The PHENOMENA™ CuDi composite alloy is a space saving, mass saving, high thermal conductivity solution for embedded computing systems employing high-power semiconductor devices such as GPUs and FPGAs. The PHENOMENA™ CuDi alloy is used to make custom heat spreaders and heat plates.
PHENOMENA I – Diamond TIM – CHARACTERISTICS:
Thermal conductivity calculated for 75ºC - 85ºC operation where each gap is filled with corresponding diamond particles:
50µm gap: 14 to 20 W/mK
100µm to 300µm gap: 15 to 22 W/mK
400µm to 500µm gap: 16 to 24 W/mK
Electrical resistance for metal-to-metal connections using metallic coated diamond particles
R > 1MΩ/1cm2 @1mm gap
Electrical resistance for semiconductor-to-metal connections using uncoated diamond particles
1012 Ω/1cm2 < R < 1014 Ω/1cm2 @1mm gap
Operating temperature
-55ºC to +200ºC
TML /evaporation 55% diamond
0.15% - 24 hrs @ +200ºC
TML /evaporation 60% diamond
0.13% - 24 hrs @ +200ºC
Saturated vapor pressure
6.0 x10-7 kPa, 60ºC≤
Corrosion test C10200
100ºC, 3hours, passed
Compatible in vacuum to
6.0 x 10-7 kPa
Dropping point
≥300ºC
Handling precautions
Do not ingest, do not allow contact with eyes
Hazardous ingredients
Abrasive diamond particles
Cleaning
Clean with alcohol
Shelf life in sealed container
10 years
Lifetime in application
10 years
PHENOMENA II - Corrosion Compatibility Analysis
PHENOMENA II – CuDi Composite Alloy – Mechanical Properties
Flexural Strength: The ability of the material to resist load forces.
Ranges from 300 to 500 MPa.
Tensile Strength: The ability of the material to resist tensile forces.
Since diamond particles are hard and brittle phases, tensile strength testing is not representative.
Yield Strength: The stress value at which the material begins to undergo plastic deformation.
Diamond-copper composite materials are brittle and do not exhibit yield strength.
Elongation: An indicator of ductility, representing the maximum extent of stretching before fracture.
Diamond-copper composite materials are brittle and do not exhibit ductility.
Hardness: The ability to resist indentation.
The hardness of diamond copper composites is influenced by the volume concentration of diamond in the material. Diamond’s Vickers hardness (HV) typically ranges between 7000 - 9000 HV (theoretical value), which is significantly higher than that of pure copper (approximately 30 -100 HV). The hardness of the material is not uniform, it exhibits a composite characteristic of high hardness in the diamond phase + high toughness in the copper phase. The copper phase primarily serves as a binder.
Fatigue Strength: The ability to withstand cyclic loading.
No testing has been conducted. Diamond-copper materials primarily focus on thermo-physical properties and interfacial bonding performance.
PHENOMENA II – CuDi Composite Alloy – Physical Properties
Density: 5 to 6 g/cm3
Melting point: The melting point of the CuDi composite material is based on the matrix copper melting point, which is above 1083°C.
Coefficient of thermal expansion: 5.0 ≤ CTE ≤ 7.2 x 1/(Kx106) from 20ºC to 200ºC
Thermal conductivity: The composite material Tc ranges from 700 – 800 W/mxK depending on thickness.
Tc attenuation: <5% after 1000 cycles from -55ºC to 175ºC, measured in % of W/mxK.
Electrical conductivity: Primarily determined by the copper matrix and varies with the volume concentration of diamond. The current product has a volume electrical conductivity of approximately 200 S/m, which is about one-third that of pure copper.
