PERFORMANCE INTERCONNECT
PHENOMENA™ TIM AND Cu-Di COMPOSITE
Advanced Diamond Composite Thermal Materials
PHENOMENA™ is the ultimate expression of performance in thermally conductive composite materials based mono-crystalline diamonds with Tc>2000W/mK.
The PHENOMENA™ I - PATENT-PENDING Thermal Interface Material is used to connect processors to heat spreaders, heat plates or to achieve large area metal-to-metal interfaces with low thermal resistance. The matrix special formulation has an ultra-high concentration of highly diffusive nano particles binding high-quality diamonds in a monolayer configuration between two surfaces to achieve the most efficient thermal transfer mechanism. The high-performance compound is compatible with high vacuum environment for space-flight applications.
The PHENOMENA™ II - Copper-Diamond (CuDi) Composite Alloy is a superlative advancement in material technology achieved through a complex sintering process combining high-quality mono-crystalline diamonds with a natural Tc > 2000W/mK and pure copper powder with a TC = 394 W/mK. The sintered composite material displays nearly "magic" thermal conductivity performance with a TC from 760 to 780 W/mK and is an extraordinary solution in conduction cooling applications regardless of their environment. It works with equal effectiveness under extreme G forces and under the harsh conditions of deep space in total absence of gravity.
The PHENOMENA™ CuDi composite alloy is a space saving, mass saving, high thermal conductivity solution for embedded computing systems employing high-power semiconductor devices such as GPUs and FPGAs. The PHENOMENA™ CuDi alloy is used to make custom heat spreaders and heat plates.
PHENOMENA I – THERMAL INTERFACE PASTE – CHARACTERISTICS:
Thermal conductivity (calculated): >20W/mxK
Electrical resistance: >1MΩ/1cm^2 @1mm gap
Operating temperature: -55ºC to +200ºC
TML /evaporation: 0.06% @ +200ºC
Saturated vapor pressure: 6.0 x10^-7 kPa, 60ºC≤
Corrosion test C10200: 100ºC, 3hours, passed
Compatible in vacuum to 6.0 x 10^-7 kPa
Dropping point ≥300ºC
Handling precautions: Do not ingest, do not allow contact with eyes
Hazardous ingredients: no hazard
Cleaning: Clean with alcohol
PHENOMENA II – CuDi Composite Alloy – Mechanical Properties
Flexural Strength: The ability of the material to resist load forces.
Ranges from 300 to 500 MPa.
Tensile Strength: The ability of the material to resist tensile forces.
Since diamond particles are hard and brittle phases, tensile strength testing is not representative.
Yield Strength: The stress value at which the material begins to undergo plastic deformation.
Diamond-copper composite materials are brittle and do not exhibit yield strength.
Elongation: An indicator of ductility, representing the maximum extent of stretching before fracture.
Diamond-copper composite materials are brittle and do not exhibit ductility.
Hardness: The ability to resist indentation.
The hardness of diamond copper composites is influenced by the volume concentration of diamond in the material. Diamond’s Vickers hardness (HV) typically ranges between 7000 - 9000 HV (theoretical value), which is significantly higher than that of pure copper (approximately 30 -100 HV). The hardness of the material is not uniform, it exhibits a composite characteristic of high hardness in the diamond phase + high toughness in the copper phase. The copper phase primarily serves as a binder.
Fatigue Strength: The ability to withstand cyclic loading.
No testing has been conducted. Diamond-copper materials primarily focus on thermo-physical properties and interfacial bonding performance.
PHENOMENA II – CuDi Composite Alloy – Physical Properties
Density: 5 to 6 g/cm3
Melting point: The melting point of the CuDi composite material is based on the matrix copper melting point, which is above 1083°C.
Coefficient of thermal expansion: 5.0 ≤ CTE ≤ 7.2 x 1/(Kx106) from 20ºC to 200ºC
Thermal conductivity: The composite material Tc ranges from 700 – 800 W/mxK depending on thickness.
Tc attenuation: <5% after 1000 cycles from -55ºC to 175ºC, measured in % of W/mxK.
Electrical conductivity: Primarily determined by the copper matrix and varies with the volume concentration of diamond. The current product has a volume electrical conductivity of approximately 200 S/m, which is about one-third that of pure copper.
